ECE 464 - Microelectronics Science and Engineering

The science and engineering of CMOS and deep sub-micron semiconductor device fabrication. Semiconductor process steps including: diffusion, oxidation, reactive ion etching, chemical etching, surface cleaning, lithography, ion implantation, thin film deposition and chemical-mechanical polishing. A CMOS process flow is outlined. Computer simulation is utilized to provide insight into ion implantation, diffusion and lithography. Lec 3

Core Curriculum/Core Requirements:

Prerequisites: PHY 122 and CHY 121 or 131;

Corequisites: MAT 258

Course Typically Offered: Spring

Credits: 3