ECE 464 - Microelectronics Science and Engineering

The science and engineering of CMOS and deep sub-micron semiconductor device fabrication. Semiconductor process steps including: diffusion, oxidation, reactive ion etching, chemical etching, surface cleaning, lithography, ion implantation, thin film deposition and chemical-mechanical polishing. A CMOS process flow is outlined. Computer simulation is utilized to provide insight into ion implantation, diffusion and lithography. Lec 3 (Spring.)

Prerequisites & Notes
CHY 121 and PHY 122. Corequisite: MAT 258.

Credits: 3